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New York funding

Modular And Conformal System-on-foil Packaging Platform For Heterogenous Integration

$875K

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Funder
Department of Defense
Amount
$875K
Recipient
Lux Semiconductors, INC
Deadline
Through September 17, 2025

Purpose

Department of Defense awarded $875K to Lux Semiconductors, INC for Modular and conformal system-on-foil packaging platform for heterogenous integration. Industry: Research And Development In The Physical, Engineering, And Life Sciences (except Nanotechnology And Biotechnology). Place of performance: NY.

federalusaspendingcontractmanufacturingny

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