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New York funding

EAGER: Collaborative Research: In situ Thermal-mechanical Localization Metrology for Advanced 3D Packaging

$150K

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Funder
National Science Foundation
Amount
$150K
Recipient
Cornell University
Deadline
Through August 31, 2028

Purpose

National Science Foundation awarded $150K to Cornell University for EAGER: Collaborative Research: In situ Thermal-mechanical Localization Metrology for Advanced 3D Packaging. Advanced three-dimensional (3D) packaging plays a critical role in the performance of miniaturized semiconductor devices. Owing to reduced component dimension, high-density stacking, and complex interconnection inherent to 3D packaging, significant temperature rise and complex thermal-mechanical stress are generated inside multiple… Location: NY.

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